Impact of Pitch Scaling on 3D Die-to-Die Interconnects

Pantano, NicolasNicolasPantanoStucchi, MicheleMicheleStucchiVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2025-04-102024-12-072025-04-102024979-8-3503-7599-20569-5503WOS:001260983500173https://imec-publications.be/handle/20.500.12860/44951Impact of Pitch Scaling on 3D Die-to-Die InterconnectsProceedings paper10.1109/ECTC51529.2024.00171979-8-3503-7598-5WOS:001260983500173