A wafer-level poly-SiGe-based thin film packaging technology demonstrated on a SOI-based high-Q MEM resonator

Helin, PhilippePhilippeHelinVerbist, AgnesAgnesVerbistDe Coster, JeroenJeroenDe CosterGuo, BinBinGuoSeveri, SimoneSimoneSeveriWitvrouw, AnnAnnWitvrouwHaspeslagh, LucLucHaspeslaghTilmans, HarrieHarrieTilmansNaito, YasuyukiYasuyukiNaitoOnishi, K.K.Onishi2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/19055A wafer-level poly-SiGe-based thin film packaging technology demonstrated on a SOI-based high-Q MEM resonatorProceedings paper