Temperature-dependent modeling and characterization of Through Silicon Via (TSV) capacitance

Katti, GuruprasadGuruprasadKattiStucchi, MicheleMicheleStucchiVelenis, DimitriosDimitriosVelenisSoree, BartBartSoreeDe Meyer, KristinKristinDe MeyerDehaene, WimWimDehaene2021-10-192021-10-1920110741-3106https://imec-publications.be/handle/20.500.12860/19162Temperature-dependent modeling and characterization of Through Silicon Via (TSV) capacitanceJournal articlehttp://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5722016