Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G

Sun, XiaoXiaoSunSlabbekoorn, JohnJohnSlabbekoornSinha, SiddharthaSiddharthaSinhaBex, PieterPieterBexPinho, NelsonNelsonPinhoWebers, TomasTomasWebersVelenis, DimitriosDimitriosVelenisMiller, AndyAndyMillerCollaert, NadineNadineCollaertVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2023-04-272022-09-172023-04-2720220569-5503WOS:000848765300002https://imec-publications.be/handle/20.500.12860/40440Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5GProceedings paper10.1109/ECTC51906.2022.00009978-1-6654-7943-1WOS:000848765300002