Hou, LinLinHouDerakhshandeh, JaberJaberDerakhshandehCapuz, GiovanniGiovanniCapuzBeyne, EricEricBeyneDe Wolf, IngridIngridDe Wolf2021-10-282021-10-2820202156-3950https://imec-publications.be/handle/20.500.12860/35284A novel intermetallic compound insertion bonding to improve throughput for sequential 3D stackingJournal articlehttps://ieeexplore.ieee.org/document/8974431