Collective die-to-wafer assembly process for optically interconnected System-on-wafer

Kennes, KoenKoenKennesDvoretskii, AntonAntonDvoretskiiPodpod, ArnitaArnitaPodpodXu, PengfeiPengfeiXuHe, JunwenJunwenHeLepage, GuyGuyLepageGolshani, NeginNeginGolshaniVerheyen, PeterPeterVerheyenMagdziak, RafalRafalMagdziakBipul, SwetanshuSwetanshuBipulPhommahaxay, AlainAlainPhommahaxayChakrabarti, MaumitaMaumitaChakrabartiMiller, AndyAndyMillerBeyne, EricEricBeyneBan, YoojinYoojinBanFerraro, FilippoFilippoFerrarovan Campenhout, JorisJorisvan Campenhout2025-02-112024-12-072025-02-112024979-8-3503-7599-20569-5503WOS:001260983500230https://imec-publications.be/handle/20.500.12860/44937Collective die-to-wafer assembly process for optically interconnected System-on-waferProceedings paper10.1109/ECTC51529.2024.00227979-8-3503-7598-5WOS:001260983500230