Special Section Guest Editorial: Packaging Challenges of Photonic Integrated Circuits

Missinne, JeroenJeroenMissinneLi, YanluYanluLiMohrdiek, StefanStefanMohrdiekMorrissey, PadraicPadraicMorrissey2025-04-102024-09-142025-04-1020241932-5150WOS:001283921400006https://imec-publications.be/handle/20.500.12860/44484Special Section Guest Editorial: Packaging Challenges of Photonic Integrated CircuitsEditorial material10.1117/1.JOM.4.1.011001WOS:001283921400006