Reliability testing of Cu-Sn intermetallic micro-bump interconnections for 3D-device stacking

Labie, RietRietLabieLimaye, PareshPareshLimayeLee, K.W.K.W.LeeBerry, C.J.C.J.BerryBeyne, EricEricBeyneDe Wolf, IngridIngridDe Wolf2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/17421Reliability testing of Cu-Sn intermetallic micro-bump interconnections for 3D-device stackingProceedings paper