Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-Silicon Via Interconnects

Civale, YannYannCivaleArmini, SilviaSilviaArminiPhilipsen, HaroldHaroldPhilipsenRedolfi, AugustoAugustoRedolfiVelenis, DimitriosDimitriosVelenisCroes, KristofKristofCroesHeylen, NancyNancyHeylenEl-Mekki, ZaidZaidEl-MekkiVandersmissen, KevinKevinVandersmissenBeyer, GeraldGeraldBeyerSwinnen, BartBartSwinnenBeyne, EricEricBeyne2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/20467Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-Silicon Via InterconnectsProceedings paper