Height uniformity of micro-bumps electroplated on thin Cu seed layers

Yang, LiuLiuYangSlabbekoorn, JohnJohnSlabbekoornHonore, MiaMiaHonoreStiers, KarenKarenStiersStruyf, HerbertHerbertStruyfVereecken, PhilippePhilippeVereeckenRadisic, AlexAlexRadisic2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/27625Height uniformity of micro-bumps electroplated on thin Cu seed layersMeeting abstracthttps://ecs.confex.com/ecs/229/webprogram/Paper68288.html