Nagano, FuyaFuyaNaganoIacovo, SerenaSerenaIacovoPhommahaxay, AlainAlainPhommahaxayInoue, FumihiroFumihiroInoueChancerel, FrancoisFrancoisChancerelNaser, HasanHasanNaserBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneDe Gendt, StefanStefanDe Gendt2022-06-302022-06-252022-06-3020222162-8769WOS:000811857900001https://imec-publications.be/handle/20.500.12860/40022Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct BondingJournal article10.1149/2162-8777/ac7662WOS:000811857900001TECHNOLOGYTUNGSTEN