ASIC chip, hybrid multisensor, and package co-design for smart gas monitoring module

Reczey, M.M.ReczeyDobay, R.R.DobayHarsanyi, G.G.HarsanyiIllyefalvi-Vitez, Z.Z.Illyefalvi-VitezVan Den Steen, JeanJeanVan Den SteenVervaet, A.A.VervaetReinert, W.W.ReinertUrbancik, J.J.UrbancikGuljaev, A.A.GuljaevVisy, C.C.VisyBarsony, I.I.Barsony2021-10-012021-10-011998https://imec-publications.be/handle/20.500.12860/2899ASIC chip, hybrid multisensor, and package co-design for smart gas monitoring moduleProceedings paper