Numerical and experimental characterization of the thermal behavior of a packaged DRAM-on-logic stack

Oprins, HermanHermanOprinsCherman, VladimirVladimirChermanVandevelde, BartBartVandeveldeVan der Plas, GeertGeertVan der PlasMarchal, PolPolMarchalBeyne, EricEricBeyne2021-10-202021-10-202012-05https://imec-publications.be/handle/20.500.12860/21235Numerical and experimental characterization of the thermal behavior of a packaged DRAM-on-logic stackProceedings paper