Ding, YouqiYouqiDingVarela Pedreira, OlallaOlallaVarela PedreiraLofrano, MelinaMelinaLofranoZahedmanesh, HoumanHoumanZahedmaneshCiofi, IvanIvanCiofiChavez, T.T.ChavezFarr, H.H.FarrDe Wolf, IngridIngridDe WolfCroes, KristofKristofCroes2025-03-042025-03-0420250021-8979WOS:001427171700004https://imec-publications.be/handle/20.500.12860/45286Cu interconnect lifetime estimation in the presence of thermal gradientsJournal article10.1063/5.0245489WOS:001427171700004STRESS EVOLUTIONELECTRIC-CURRENTELECTROMIGRATIONTHERMOMIGRATIONRELIABILITYTEMPERATURE