Cu interconnect lifetime estimation in the presence of thermal gradients

Ding, Y.Y.DingPedreira, O. VarelaO. VarelaPedreiraLofrano, M.M.LofranoZahedmanesh, H.H.ZahedmaneshCiofi, I.I.CiofiChavez, T.T.ChavezFarr, H.H.FarrDe Wolf, I.I.De WolfCroes, K.K.Croes2025-03-042025-03-042025-FEB 20021-8979WOS:001427171700004https://imec-publications.be/handle/20.500.12860/45286Cu interconnect lifetime estimation in the presence of thermal gradientsJournal article10.1063/5.0245489WOS:001427171700004STRESS EVOLUTIONELECTRIC-CURRENTELECTROMIGRATIONTHERMOMIGRATIONRELIABILITYTEMPERATURE