Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers

Limaye, PareshPareshLimayeVandevelde, BartBartVandeveldeLabie, RietRietLabieRatchev, PetarPetarRatchevBeyne, EricEricBeyneVandepitte, DirkDirkVandepitteVerlinden, BertBertVerlinden2021-10-162021-10-162005https://imec-publications.be/handle/20.500.12860/10784Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layersProceedings paper