Roelkens, GuntherGuntherRoelkensVan Thourhout, DriesDriesVan ThourhoutChristiaens, IlseIlseChristiaensBaets, RoelRoelBaetsSmit, MeintMeintSmit2021-10-162021-10-162005https://imec-publications.be/handle/20.500.12860/11117Ultra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic componentsProceedings paper