Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnections

Siau, SamSamSiauVervaet, AlfonsAlfonsVervaetSchacht, EtienneEtienneSchachtVan Calster, AndreAndreVan Calster2021-10-152021-10-152004https://imec-publications.be/handle/20.500.12860/9593Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnectionsJournal article