Demonstration of a collective hybrid die-to-wafer integration

Suhard, SamuelSamuelSuhardPhommahaxay, AlainAlainPhommahaxayKennes, KoenKoenKennesBex, PieterPieterBexFodor, FerencFerencFodorBeyne, EricEricBeyneLiebens, MaartenMaartenLiebensSlabbekoorn, JohnJohnSlabbekoornMiller, AndyAndyMillerBeyer, GeraldGeraldBeyer2022-01-072021-11-022022-01-0720200569-5503WOS:000620983200196https://imec-publications.be/handle/20.500.12860/38151Demonstration of a collective hybrid die-to-wafer integrationProceedings paper10.1109/ECTC32862.2020.00208978-1-7281-6180-8WOS:000620983200196