La Manna, AntonioAntonioLa MannaRebibis, Kenneth JuneKenneth JuneRebibisGerets, CarineCarineGeretsBeyne, EricEricBeyne2021-10-202021-10-2020121551-4897https://imec-publications.be/handle/20.500.12860/20975Use of wafer applied underfill for 3D stackingJournal articlehttp://www.imaps.org/imapsstore/detail.aspx?ID=3924