The impact of sequential-3D integration on semiconductor scaling roadmap

Mallik, ArindamArindamMallikVandooren, AnneAnneVandoorenWitters, LiesbethLiesbethWittersWalke, AmeyAmeyWalkeFranco, JacopoJacopoFrancoSherazi, YasserYasserSheraziWeckx, PieterPieterWeckxYakimets, DmitryDmitryYakimetsGarcia Bardon, MarieMarieGarcia BardonParvais, BertrandBertrandParvaisDebacker, PeterPeterDebackerKu, B.W.B.W.KuLim, S.K.S.K.LimMocuta, AndaAndaMocutaMocuta, DanDanMocutaRyckaert, JulienJulienRyckaertCollaert, NadineNadineCollaertRaghavan, PraveenPraveenRaghavan2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/28905The impact of sequential-3D integration on semiconductor scaling roadmapProceedings paperhttp://ieeexplore.ieee.org/document/8268483/