Extending on-die wiring hierarchy with wafer-level packaging concepts

Balachandran, JayaprakashJayaprakashBalachandranBrebels, StevenStevenBrebelsCarchon, GeertGeertCarchonWebers, TomasTomasWebersDe Raedt, WalterWalterDe RaedtNauwelaers, BartBartNauwelaersBeyne, EricEricBeyne2021-10-152021-10-152004https://imec-publications.be/handle/20.500.12860/8529Extending on-die wiring hierarchy with wafer-level packaging conceptsProceedings paper