Thermal expansion coefficients of ultralow-k dielectric films by cube corner indentation tests at elevated temperatures

Vanstreels, KrisKrisVanstreelsZahedmanesh, HoumanHoumanZahedmaneshHangen, UdeUdeHangen2021-10-232021-10-2320150003-6951https://imec-publications.be/handle/20.500.12860/26114Thermal expansion coefficients of ultralow-k dielectric films by cube corner indentation tests at elevated temperaturesJournal articlehttp://dx.doi.org/10.1063/1.4936996