Prediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips to striplines

Kok, PeterPeterKokDe Zutter, DanielDanielDe Zutter2021-09-292021-09-291994https://imec-publications.be/handle/20.500.12860/216Prediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips to striplinesJournal article