Preliminary hard X-ray micro-spectroscopic investigations on thin-film Ta-and-W based diffusion barriers for copper interconnect technology

Ablett, J.M.J.M.AblettWoicik, J.C.J.C.WoicikTokei, ZsoltZsoltTokei2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/11617Preliminary hard X-ray micro-spectroscopic investigations on thin-film Ta-and-W based diffusion barriers for copper interconnect technologyProceedings paper