Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments

Armini, SilviaSilviaArminiEl-Mekki, ZaidZaidEl-MekkiSwerts, JohanJohanSwertsNagar, MagiMagiNagarDemuynck, StevenStevenDemuynck2021-10-212021-10-2120130013-4651https://imec-publications.be/handle/20.500.12860/21981Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experimentsJournal article