Optimized pore stuffing for enhanced compatibility with interconnect integration flow

de Marneffe, Jean-FrancoisJean-Francoisde MarneffeZhang, LipingLipingZhangRutigliani, VitoVitoRutiglianiNoya, G.G.NoyaCao, YiYiCaoLesniewska, AlicjaAlicjaLesniewskaVarela Pedreira, OlallaOlallaVarela PedreiraCroes, KristofKristofCroesGillot, ChristopheChristopheGillotTokei, ZsoltZsoltTokeiBoemmels, JuergenJuergenBoemmelsBaklanov, MikhaïlMikhaïlBaklanov2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25142Optimized pore stuffing for enhanced compatibility with interconnect integration flowProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325639