3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI

Sirbu, B.B.SirbuEichhammer, Y.Y.EichhammerOppermann, H.H.OppermannTekin, T.T.TekinKraft, J.J.KraftSidorov, V.V.SidorovYin, XinXinYinBauwelinck, JohanJohanBauwelinckNeumeyr, C.C.NeumeyrSoares, F.F.Soares2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/340203D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOIProceedings paperhttps://ieeexplore.ieee.org/document/8811251