Test structures for characterization of thermal-mechanical stress in 3D stacked IC for analog design

Minas, NikolaosNikolaosMinasVan der Plas, GeertGeertVan der PlasOprins, HermanHermanOprinsYang, YuYuYangOkoro, ChukwudiChukwudiOkoroMercha, AbdelkarimAbdelkarimMerchaTorregiani, CristinaCristinaTorregianiPerry, DanDanPerryMarchal, PolPolMarchalRakowski, MichalMichalRakowskiCherman, VladimirVladimirCherman2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/17634Test structures for characterization of thermal-mechanical stress in 3D stacked IC for analog designProceedings paper