Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments

Armini, SilviaSilviaArminiDemuynck, StevenStevenDemuynckEl-Mekki, ZaidZaidEl-MekkiSwerts, JohanJohanSwertsNagar, MagiMagiNagarRadisic, AlexAlexRadisicHeylen, NancyNancyHeylenBeyer, GeraldGeraldBeyerLeunissen, PeterPeterLeunissenVereecken, PhilippePhilippeVereecken2021-10-192021-10-192011-05https://imec-publications.be/handle/20.500.12860/18487Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experimentsProceedings paper