Salahouelhadj, AbdellahAbdellahSalahouelhadjGonzalez, MarioMarioGonzalezVanstreels, KrisKrisVanstreelsVan der Plas, GeertGeertVan der PlasBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2023-07-072023-03-242023-07-0720230167-9317WOS:000944642500001https://imec-publications.be/handle/20.500.12860/41344Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validationJournal article10.1016/j.mee.2023.111947WOS:000944642500001PBGA