Barrier/liner stacks for scaling the Cu interconnect metallization

van der Veen, MarleenMarleenvan der VeenJourdan, NicolasNicolasJourdanVega Gonzalez, VictorVictorVega GonzalezWilson, ChrisChrisWilsonHeylen, NancyNancyHeylenVarela Pedreira, OlallaOlallaVarela PedreiraStruyf, HerbertHerbertStruyfCroes, KristofKristofCroesBoemmels, JuergenJuergenBoemmelsTokei, ZsoltZsoltTokei2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/27451Barrier/liner stacks for scaling the Cu interconnect metallizationProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7507649