Brongersma, SywertSywertBrongersmaKerr, EmmaEmmaKerrVervoort, IwanIwanVervoortMaex, KarenKarenMaex2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6068Grain structure evolution during annealing of electroplated copperProceedings paper