High-speed TSV integration in an active silicon photonics interposer platform

Bogaerts, LieveLieveBogaertsEl-Mekki, ZaidZaidEl-MekkiVan Huylenbroeck, StefaanStefaanVan HuylenbroeckNolmans, PhilipPhilipNolmansPantano, NicolasNicolasPantanoSun, XiaoXiaoSunRakowski, MichalMichalRakowskiVelenis, DimitriosDimitriosVelenisVerheyen, PeterPeterVerheyenBalakrishnan, SadhishkumarSadhishkumarBalakrishnanDe Heyn, PeterPeterDe HeynBan, YoojinYoojinBanSrinivasan, AshwynAshwynSrinivasanLardenois, SebastienSebastienLardenoisDe Coster, JeroenJeroenDe CosterDetalle, MikaelMikaelDetalleAbsil, PhilippePhilippeAbsilMiller, AndyAndyMillerPantouvaki, MariannaMariannaPantouvakiVan Campenhout, JorisJorisVan Campenhout2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/30274High-speed TSV integration in an active silicon photonics interposer platformProceedings paperhttps://ieeexplore.ieee.org/document/8640164