De Wolf, IngridIngridDe WolfSoper, A.A.SoperPozza, G.G.PozzaIgnat, M.M.IgnatParat, G.G.ParatMaes, HermanHermanMaes2021-09-302021-09-301997https://imec-publications.be/handle/20.500.12860/1830Experimental and analytical evaluation of stress fields fenerated by solder bump interconnectionsProceedings paper