Chip package interaction (CPI): thermo mechanical challenges in 3D technologies

Gonzalez, MarioMarioGonzalezVandevelde, BartBartVandeveldeIvankovic, AndrejAndrejIvankovicCherman, VladimirVladimirChermanDebecker, BjornBjornDebeckerLofrano, MelinaMelinaLofranoDe Wolf, IngridIngridDe WolfBeyer, GeraldGeraldBeyerSwinnen, BartBartSwinnenTokei, ZsoltZsoltTokeiBeyne, EricEricBeyne2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/20735Chip package interaction (CPI): thermo mechanical challenges in 3D technologiesProceedings paper