Lantasov, YuriYuriLantasovMin, Woo SigWoo SigMinPalmans, RogerRogerPalmansMaex, KarenKarenMaex2021-10-062021-10-061999https://imec-publications.be/handle/20.500.12860/3609New plating path for electroless copper deposition on sputtered barrier layersOral presentation