In-line SEM Evaluation Technique for Cu Pad Nanotopography for Hybrid Bonding Applications

Kasai, HiroakiHiroakiKasaiHasumi, KazuhisaKazuhisaHasumiMise, NobuyukiNobuyukiMiseOsaki, MayukaMayukaOsakiChew, Soon AikSoon AikChewTunca Altintas, BensuBensuTunca AltintasZhang, BoyaoBoyaoZhangMoussa, AlainAlainMoussaCharley, Anne-LaureAnne-LaureCharleyBeyne, EricEricBeyneLorusso, GianGianLorussoMiller, AndyAndyMillerTanaka, MakiMakiTanaka2025-05-122025-03-042025-05-122024979-8-3503-7782-82373-5449WOS:001412986500024https://imec-publications.be/handle/20.500.12860/45301In-line SEM Evaluation Technique for Cu Pad Nanotopography for Hybrid Bonding ApplicationsProceedings paper10.1109/ICSJ62869.2024.10804745979-8-3503-7781-1WOS:001412986500024