Thermo-compression flip chip bonding using gold ball bumps for RF and MEMS application

Stoukatch, SergueiSergueiStoukatchWebers, TomasTomasWebersWinters, ChristopheChristopheWintersBaert, KrisKrisBaertBeyne, EricEricBeyne2021-10-152021-10-152004https://imec-publications.be/handle/20.500.12860/9646Thermo-compression flip chip bonding using gold ball bumps for RF and MEMS applicationProceedings paper