Zhang, WenqiWenqiZhangLimaye, PareshPareshLimayeLa Manna, AntonioAntonioLa MannaSoussan, PhilippePhilippeSoussan2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/20212Fine pitch micro-bump interconnections for advanced 3D chip stackingProceedings paper