Wang, LiangLiangWangCauwe, MaartenMaartenCauweBrebels, StevenStevenBrebelsDe Raedt, WalterWalterDe RaedtVanfleteren, JanJanVanfleteren2021-10-212021-10-2120130305-6120https://imec-publications.be/handle/20.500.12860/23374Self-aligned flat ultra-thin chip package for flexible circuitsJournal article