Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics

Madadnia, BehnamBehnamMadadniaBossuyt, FrederickFrederickBossuytVanfleteren, JanJanVanfleteren2023-07-032023-06-202023-07-0320220268-3768WOS:000745612400008https://imec-publications.be/handle/20.500.12860/41940Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronicsJournal article10.1007/s00170-022-08680-9WOS:000745612400008