Bose, AnkitAnkitBoseVijayaraghavan, Rajani KRajani KVijayaraghavanCowley, AidanAidanCowleyCherman, VladimirVladimirChermanVarela Pedreira, OlallaOlallaVarela PedreiraTanner, Brian K.Brian K.TannerDanilewsky, Andreas N.Andreas N.DanilewskyDe Wolf, IngridIngridDe WolfMcNally, Patrick J.Patrick J.McNally2021-10-232021-10-2320162156-3950https://imec-publications.be/handle/20.500.12860/26370Nondestructive monitoring of die warpage in encapsulated chip packagesJournal articlehttp://ieeexplore.ieee.org/document/7425195/