Thermal analysis of a 3D flip-chip fan-out wafer level package (fcFOWLP) for high bandwidth 3D integration

Oprins, HermanHermanOprinsBeyne, EricEricBeyne2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/33705Thermal analysis of a 3D flip-chip fan-out wafer level package (fcFOWLP) for high bandwidth 3D integrationProceedings paperhttps://ieeexplore.ieee.org/document/8757368