The vacuum wafer bonding technique as an alternative method for the fabrication of metal/semiconductor heterostructures

Dessein, KristofKristofDesseinKumar, P. S. A.P. S. A.KumarNemeth, StefanStefanNemethDelaey, L.L.DelaeyBorghs, GustaafGustaafBorghsDe Boeck, JoJoDe Boeck2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/5244The vacuum wafer bonding technique as an alternative method for the fabrication of metal/semiconductor heterostructuresJournal article