Introducing a silicone under the bump configuration for stress relief in a wafer level package

Vanden Bulcke, MathieuMathieuVanden BulckeGonzalez, MarioMarioGonzalezVandevelde, BartBartVandeveldeWinters, ChristopheChristopheWintersBeyne, EricEricBeyneLarson, L.L.LarsonHarkness, B.R.B.R.HarknessGardner, G.G.GardnerMohamed, M.M.MohamedSudbury-Holtschlag, J.J.Sudbury-HoltschlagMeynen, H.H.Meynen2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/8311Introducing a silicone under the bump configuration for stress relief in a wafer level packageProceedings paper