A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond

Op de Beeck, MaaikeMaaikeOp de BeeckVersluijs, JankoJankoVersluijsTokei, ZsoltZsoltTokeiDemuynck, StevenStevenDemuynckde Marneffe, Jean-FrancoisJean-Francoisde MarneffeBoullart, WernerWernerBoullartVanhaelemeersch, SergeSergeVanhaelemeerschZhu, HelenHelenZhuCirigliano, PeterPeterCiriglianoPavel, ElisabethElisabethPavelSadjadi, RezaRezaSadjadiKim, JisooJisooKim2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/12646A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyondProceedings paper