Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy

Jacobs, Kristof J.P.Kristof J.P.JacobsStucchi, MicheleMicheleStucchiBeyne, EricEricBeyne2023-08-082023-06-202023-06-292023-08-0820210018-9456WOS:000698641700001https://imec-publications.be/handle/20.500.12860/41973Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance MicroscopyJournal article10.1109/TIM.2021.3108531WOS:000698641700001SILICONCAPACITANCE