El-Mekki, ZaidZaidEl-MekkiPhilipsen, HaroldHaroldPhilipsenHonore, MiaMiaHonoreRadisic, AlexAlexRadisicSlabbekoorn, JohnJohnSlabbekoornArnold, MarcoMarcoArnoldFluegel, AlexanderAlexanderFluegelShu-Ya Chang, IrisIrisShu-Ya ChangStruyf, HerbertHerbertStruyfMayer, DieterDieterMayer2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/26597Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applicationsMeeting abstract