Li, HeHeLiPannier, TinusTinusPannierGu, YeYeGuRamaswamy, PrasannaPrasannaRamaswamyLoi, RuggeroRuggeroLoiHeise, PatrickPatrickHeiseInac, MesutMesutInacFarrell, AlexAlexFarrellTrindade, Antonio JoseAntonio JoseTrindadeFecioru, AlinAlinFecioruDhaenens, KristofKristofDhaenensDe Baere, ToonToonDe BaereSingh, NishantNishantSinghBogaert, LaurensLaurensBogaertQin, SenbiaoSenbiaoQinPan, BiweiBiweiPanZhang, JingJingZhangVan Steenberge, GeertGeertVan SteenbergeOssieur, PeterPeterOssieurRoelkens, GuntherGuntherRoelkens2026-07-092026-07-0920261077-260Xhttps://imec-publications.be/handle/20.500.12860/59798We demonstrate micro-transfer printing (μTP) and post-printing metallization of thin electronic chiplets on silicon, with a view to heterogeneously integrate electronic integrated circuits (EICs) with photonic integrated circuits (PICs). μTP decouples the fabrication of EICs and PICs, and simultaneously enables their tight integration with high-throughput, small form-factor and on wafer-scale. In this study, we successfully established the process flow for releasing and printing 300 μm × 200 μm SiGe BiCMOS electronic driver chiplets and electrically connecting these chiplets using a polymer ramp to overcome the 20-μ m chiplet thickness, providing a gain of 14 dB and bandwidth of over 35 GHz with low-parasitic interconnections. The proposed methodology provides a practical and mass-producible solution to realize the stacking of EICs on silicon photonic wafers for emerging applications such as co-packaged optics (CPO).engJournal article10.1109/jstqe.2026.3664420WOS:001711628700001PHOTONICSWAFER