Substrate bonding techniques for CMOS processed wafers

van der Groen, SonjaSonjavan der GroenRosmeulen, MaartenMaartenRosmeulenBaert, KrisKrisBaertJansen, PhilippePhilippeJansenDeferm, LudoLudoDeferm2021-09-292021-09-291996https://imec-publications.be/handle/20.500.12860/1566Substrate bonding techniques for CMOS processed wafersProceedings paper